MRC | Criteria | Characteristic |
---|
ABBH | INCLOSURE MATERIAL | METAL" |
ABHP | OVERALL LENGTH | 0.505 INCHES MAXIMUM" |
AKPV | MOUNTING FACILITY QUANTITY | 1" |
AXGY | MOUNTING METHOD | THREADED STUD" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE" |
CCDG | OVERALL WIDTH ACROSS FLATS | 0.562 INCHES MAXIMUM" |
CQJX | NOMINAL THREAD SIZE | 0.250 INCHES" |
CTMZ | III SEMICONDUCTOR MATERIAL | SILICON" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 16.00 AMPERES FORWARD CURRENT, AVERAGE ABSOLUTE" |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION" |
FEAT | SPECIAL FEATURES | INTERNAL JUNCTION CONFIGURATION ARRANGEMENT PNPN" |
THSD | THREAD SERIES DESIGNATOR | UNF" |
TTQY | TERMINAL TYPE AND QUANTITY | 1 THREADED STUD AND 2 TAB, SOLDER LUG" |
ABBH | INCLOSURE MATERIAL | METAL" |
ABHP | OVERALL LENGTH | 0.505 INCHES MAXIMUM" |
AKPV | MOUNTING FACILITY QUANTITY | 1" |
AXGY | MOUNTING METHOD | THREADED STUD" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE" |
CCDG | OVERALL WIDTH ACROSS FLATS | 0.562 INCHES MAXIMUM" |
CQJX | NOMINAL THREAD SIZE | 0.250 INCHES" |
CTMZ | III SEMICONDUCTOR MATERIAL | SILICON" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 16.00 AMPERES FORWARD CURRENT, AVERAGE ABSOLUTE" |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION" |
FEAT | SPECIAL FEATURES | INTERNAL JUNCTION CONFIGURATION ARRANGEMENT PNPN" |
THSD | THREAD SERIES DESIGNATOR | UNF" |
TTQY | TERMINAL TYPE AND QUANTITY | 1 THREADED STUD AND 2 TAB, SOLDER LUG" |