Aerospace Engineering Solutions is proud to offer immediate purchasing options on Advanced Micro Devices Inc part number 91L02DM-B, a Microcircuit Memory product we carry that is listed with the NSN 5962-01-043-6195 for ease of identification. If you would like to learn more about this item, be sure to complete the Request for Quote (RFQ) form provided on this page. By including essential details like your target price, desired quantity, and expected fulfillment timeline, you are ensured a fully customized quote from our team.
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For your reference, this product is traceable to Advanced Micro Devices Inc through the CAGE Code 34335, as well as categorized under FSC 5962 Microcircuits Electronic based on the first four digits of the NSN 5962-01-043-6195. Using such information, you can easily narrow down exact items of need for an ease of procurement. With our quotation service in mind, be sure to submit a completed form when you are ready to begin. Should you wish to speak with one of our representatives to discuss services, you can also give us a call or email at your convenience. With all that we offer, choose Aerospace Engineering Solutions for part number 91L02DM-B and other NSN items of need.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-043-6195 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010436195 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 91L02DM-B | 3 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 13 INPUT |
| ADAT | Body Width | 0.278 INCHES MINIMUM AND 0.298 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC AND GLASS |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE AND W/DECODED OUTPUT |
| ADAQ | Body Length | 0.770 INCHES MINIMUM AND 0.808 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 260.0 MILLIWATTS |
| ADAU | Body Height | 0.085 INCHES MINIMUM AND 0.124 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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