Aerospace Engineering Solutions is proud to offer immediate purchasing options on Atmel Corporation part number AT28C010-12EM 883, a Microcircuit Memory product we carry that is listed with the NSN 5962-01-507-0846 for ease of identification. If you would like to learn more about this item, be sure to complete the Request for Quote (RFQ) form provided on this page. By including essential details like your target price, desired quantity, and expected fulfillment timeline, you are ensured a fully customized quote from our team.
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For your reference, this product is traceable to Atmel Corporation through the CAGE Code 1FN41, as well as categorized under FSC 5962 Microcircuits Electronic based on the first four digits of the NSN 5962-01-507-0846. Using such information, you can easily narrow down exact items of need for an ease of procurement. With our quotation service in mind, be sure to submit a completed form when you are ready to begin. Should you wish to speak with one of our representatives to discuss services, you can also give us a call or email at your convenience. With all that we offer, choose Aerospace Engineering Solutions for part number AT28C010-12EM 883 and other NSN items of need.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-507-0846 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 015070846 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-3826707MUA | 5 | 2 | 2 |
| MRC | Criteria | Characteristic |
|---|---|---|
| TTQY | Terminal Type And Quantity | 32 LEADLESS |
| AGAV | End Item Identification | F-15(AN/ASQ-195) |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| FEAT | Special Features | 10 MILLISEC WRITE SPEED, BYTE/PAGE WRITE MODE, 10,000 CYCLE ENDURANCE |
| CZZZ | Memory Capacity | 128K X 8 |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE |
| ADAT | Body Width | 0.458 INCHES MAXIMUM |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
| ADAQ | Body Length | 0.560 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| MRC | Decoded Requirement | Clear Text Reply |
| CXCY | Part Name Assigned By Controlling Agency | MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K X 8 BIT EEPROM MONOLITHIC SILICON |
| ADAU | Body Height | 0.120 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CZEQ | Time Rating Per Chacteristic | 120.00 NANOSECONDS MAXIMUM ACCESS |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | EEPROM |
| CRTL | Criticality Code Justification | CBBL |
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