Aerospace Engineering Solutions is proud to offer immediate purchasing options on Nimikkeistokeskus Ncb Finland part number 10133858, a Microcircuit Memory product we carry that is listed with the NSN 5962-01-338-1299 for ease of identification. If you would like to learn more about this item, be sure to complete the Request for Quote (RFQ) form provided on this page. By including essential details like your target price, desired quantity, and expected fulfillment timeline, you are ensured a fully customized quote from our team.
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For your reference, this product is traceable to Nimikkeistokeskus Ncb Finland through the CAGE Code A486G, as well as categorized under FSC 5962 Microcircuits Electronic based on the first four digits of the NSN 5962-01-338-1299. Using such information, you can easily narrow down exact items of need for an ease of procurement. With our quotation service in mind, be sure to submit a completed form when you are ready to begin. Should you wish to speak with one of our representatives to discuss services, you can also give us a call or email at your convenience. With all that we offer, choose Aerospace Engineering Solutions for part number 10133858 and other NSN items of need.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-338-1299 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013381299 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 8507005-231 | 5 | 1 | C | A |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND MONOLITHIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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