Aerospace Engineering Solutions is proud to offer immediate purchasing options on Raytheon Company part number 5059107-01-08, a Microcircuit Memory product we carry that is listed with the NSN 5962-01-355-3766 for ease of identification. If you would like to learn more about this item, be sure to complete the Request for Quote (RFQ) form provided on this page. By including essential details like your target price, desired quantity, and expected fulfillment timeline, you are ensured a fully customized quote from our team.
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For your reference, this product is traceable to Raytheon Company through the CAGE Code 82577, as well as categorized under FSC 5962 Microcircuits Electronic based on the first four digits of the NSN 5962-01-355-3766. Using such information, you can easily narrow down exact items of need for an ease of procurement. With our quotation service in mind, be sure to submit a completed form when you are ready to begin. Should you wish to speak with one of our representatives to discuss services, you can also give us a call or email at your convenience. With all that we offer, choose Aerospace Engineering Solutions for part number 5059107-01-08 and other NSN items of need.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-355-3766 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013553766 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 8103607SA | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.540 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 185.00 MILLIAMPERES REVERSE CURRENT,DC ABSOLUTE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ABKW | OVERALL HEIGHT | 0.045 INCHES MINIMUM AND 1.000 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND PROGRAMMABLE AND BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR INVERT GATE ARRAY |
| CZER | MEMORY DEVICE TYPE | PAL |
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