Aerospace Engineering Solutions is proud to offer immediate purchasing options on St Microelectronics Ltd part number MKB4118-3, a Microcircuitmemory product we carry that is listed with the NSN 5962-01-113-7050 for ease of identification. If you would like to learn more about this item, be sure to complete the Request for Quote (RFQ) form provided on this page. By including essential details like your target price, desired quantity, and expected fulfillment timeline, you are ensured a fully customized quote from our team.
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For your reference, this product is traceable to St Microelectronics Ltd through the CAGE Code 50088, as well as categorized under FSC 5962 Microcircuits Electronic based on the first four digits of the NSN 5962-01-113-7050. Using such information, you can easily narrow down exact items of need for an ease of procurement. With our quotation service in mind, be sure to submit a completed form when you are ready to begin. Should you wish to speak with one of our representatives to discuss services, you can also give us a call or email at your convenience. With all that we offer, choose Aerospace Engineering Solutions for part number MKB4118-3 and other NSN items of need.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-113-7050 Item Description: MICROCIRCUIT,MEMORY | 5962 | 011137050 | N | |||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
MKB4118-3 | 3 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 18 INPUT |
TEST | Test Data Document | 13973-839201-0018 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CQSJ | Inclosure Material | CERAMIC |
MRC | Decoded Requirement | Clear Text Reply |
TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
ADAT | Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE AND PROGRAMMED |
CWSG | Terminal Surface Treatment | SOLDER |
ADAQ | Body Length | 1.290 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
CTFT | Case Outline Source And Designator | D-3 MIL-M-38510 |
AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
CZER | Memory Device Type | RAM |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
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